As a global provider of advanced embedded semiconductors for harsh environments, Teledyne e2v Semiconductors has developed a memory offering to address the high-reliability market.

• The 4GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications

• Teledyne e2v’s MRAMs is the ideal memory solution for applications that must permanently store and retrieve critical data quickly. It perfectly suits the requirements of critical embedded applications such as avionics, aerospace and defence environments.